The HATS²™ Test System

HATS²™ Micro Via Study for IPC/imec/ESA

By Bob Neves - Presented at the IPC Apex/Expo Conference March 2021

The IPC's Microvia Task Group commissioned a test program to study the impact of various 3 layer microvia structures. This test report encompasses Soldering Process Survivability Testing, Reliability Testing and Robustness Testing performed using a HATS²™ tester.

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HATS² and the HATS² Logo are Internationally Registered Trademarks ® of Reliability Assessment Solutions Inc.
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* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Japanese Patent 7,291,045. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending

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