HATS²™ Test System
Testing of IPC-2221B Type "D", HATS²™ Single Via Coupons*, Substrate & Custom Coupons of up to 7 Test Nets
72 IPC "D" or 36 HATS²™ Single Via* / Custom Coupon Test Chamber Capacity
Air-To-Air Thermal Shock Compliant With IPC-TM-650 Method 2.6.7.2C
Rapid Temperature Cycles or Custom Profiles Between -65°C to +265°C
Reduced Thermal Shock Cycle Time by 60 to 80% (~1000 Cycles per Week)
Convection Reflow Assembly Simulation Compliant with IPC-TM-650 Method 2.6.27B with In-Situ Resistance Monitoring
Built-In Reflow Profiler Allows any Reflow Cycle to be Simulated Automatically
Robustness Testing of Unlimited Consecutive Reflow Cycles or any Cycle from -65°C to 265°C
Use HATS²™ Technology to Increase Quality and Reliability of your Electronic Systems
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The Via Structures found in PCBs and Substrates have evolved to a size where it is impossible to evaluate them in the microsection for product quality conformance.
The HATS²™ Test System Allows you to Precisely Simulate the Environment Found in a Convection Reflow Oven
Direct Feedback From Surface of Test Coupons Used to Control Environment
The HATS²™ Test System Allows Completed Thermal Shock Tests 4-6 Times Faster than Dual Chamber Units
High Volume Airflow Past Vertical Samples Maximizes Heat Transfer to Test Coupons
Use the HATS²™ Test System to Understand how Changes in Processes Affect Via Structure Reliability & Robustness
See How New Materials, Chemicals or Processes Changes Affect Via Structure Reliability & Robustness
Perform Rapid Thermal Shock Testing using the HATS²™ Test System to Assess Via Structure Reliability
Overstress Samples with Multiple Reflow Simulations to Rapidly Assess Via Structure Robustness
The introduction of HATS²™ Technology meets the rapid reliability testing needs for the PCB industry, greatly speeding up our R&D, iteration and large-scale application of new techniques helping to Improve TTM's Products
Dr. Canny Zheng
Ph. D, CAS&ST Manager- Commercial Technology
TTM Technologies (Guangzhou)
The support from Reliability Assessment Solutions Team and the HATS²™ Test System has been instrumental for getting the reliability insights and for achieving a statistically relevant dataset in frame of the global benchmark study led by the microvia reliability subcommittee IPC-V-TLS-MVIA-EU. The working group convenors, Maarten Cauwe from IMEC and Stan Heltzel from the European Space Agency, are thankful for this important contribution.
Dr. Ir. MAARTEN CAUWE
Team Leader Flexible Microsystems for Health at Cmst,
associated imec laboratory at Ghent University
It's been a year since Unimicron purchased the HATS²™ Test System. It is easy to operate and has been performing glitch-free for all our testing endeavors since its purchase.
Mr. Xue XiHuang
Quality Manager
Unimicron
A complete test system that gives you insight into the expected performance and reliability of the PCBs and Substrates going into your electronic products
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* U.S. Patent 10,379,153. German Patent 10 2019 006 553.0. Japanese Patent 7,291,045. Chinese Patent ZL 201922142627.1. Worldwide Patents Pending
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