HATS COUPON GENERATOR 2.0
For Help place your mouse over the Red ?
 
CONTACT INFORMATION
First Name
Last Name
Company Name
Phone Number
Email Address
Retype Email Address
 
COUPON INFORMATION
Width of Coupon Select the desired width of the test coupon.  inches
Height of Coupon Select the desired height of the test coupon.  inches
Total Number of Layers Select the Total Number of Layers in the coupon here.
Soldermask Expansion Select the desired clearance distance between the edge of the soldermask and the edge of the pad.  mils
Min. Feature-To-Feature Clearance Select the minimum desired clearance spacing between conductors.  mils
Plane Layers Enter the layers that are "power" or "ground" in your design. These layers will not be used for routing of test circuitry. To add layers, hold the "ctrl" or "mac" key down while making the Selection(s) with the mouse. The order is not important.
Ground Plane Relief Select the desired spacing between the hole and the ground/power plane(s).  mils
 
NET INFORMATION
  Net I Net II Net III Net IV
Net Type This coupon generator allows the use of 4 different kinds of via structures. Each of the 4 nets on the coupon can have a different via structure. Select one of the following 4 types of via structures for each of the 4 nets.

1) "Through" via [vias that go all the way through the PCB]

2) "Blind" via [vias (drilled or micro) that do not go all the way through the PCB]

3) "Buried" via [vias that do not start or end on the outer layers and are totally contained within the PCB]

4) "Stacked" via [vias that start on the outer layer and extend 2 layers into the PCB with an intermediary pad on the layer nearest to the outer layer] ***

*** NOTE: For a given net, stacked vias may start from layer 1 OR the last layer - but NOT both! Two nets are required if stacked vias are desired on both sides of the board.
Hole Diameter (mils) For mechanically-drilled holes, select the drill diameter to be used for the via structure. For other holes, select diameter of the drilled hole, prior to plating.
Land Diameter (mils) Select the desired land (pad) diameter of the via structure.
Track Width (mils) Enter the width of the conductor that will connect the via structures in increments 0.001".
Interconnect Sequence Select one of the following 3 types of interconnection sequences. The coupon generator will automatically route the interconnection sequence based upon your Selection.

Outer Layers: Selecting This will detect barrel cracks and corner cracks but will not detect Interconnection Separation.

Outer 2 Signal Layers: Selecting This will detect barrel cracks and corner cracks and will detect Interconnection Separation on the layers most likely to have it. Plane Layers will not be used in the interconnect sequence.

All Signal Layers: Selecting This will detect barrel cracks and corner cracks and will detect Interconnection Separation but may not have many connections on outer layers where the separation is likely to occur. Plane Layers will not be used in the interconnect sequence.

For Blind and Buried vias, Select the Top and Bottom layers of the via. For Stacked vias, Select the Top layer of the via.

Via Top Layer     
Via Bottom Layer 

Via Top Layer     
Via Bottom Layer 

Via Top Layer     
Via Bottom Layer 

Via Top Layer     
Via Bottom Layer 
Cover with Soldermask Select "YES" if you want the via structures in a net to be covered with Soldermask. Select "NO" if you do not want the via structures to be covered with Soldermask.
Include Non-Functional Lands Select "YES" if you want the via structures to include lands that are not used for interconnecting the test pattern. Select "NO" if you do not want the via structures to include lands that are not used for interconnecting the test pattern.
Add Teardrops Select "YES"; if you want the via structures to include a teardrop shape where the interconnecting circuit and the pad meet. Select "NO" if you do not want the via structures to include a teardrop shape where the interconnecting circuit and the pad meet.
Via Grid (mils) Select the desired grid on which the via structures should be centered. The minimum value contained in the dropdown box is calculated based upon the minimum feature-to-feature clearance and land diameter Selections made above.

 Send a Zip File: (Default) This option sends all your files in one compressed Zip file to the email entered.

Send a Download Link: Select this option if your email server removes or blocks Zip files. This option will send a link to the Zip file in an email that will allow you to download it.